Personal Web Page: | http://vivekchaturvedi. |
|||||||||
Email: | vchat001@fiu.edu v.chaturvedi05@gmail.com | |||||||||
Education: |
|
|||||||||
Research Interests: | Power/Thermal Aware Real-Time Scheduling, Advanced Computer Architecture, VLSI Design, Pre/Post – Silicon Verification/Validation, Energy Efficient Cloud Computing | |||||||||
Research Projects: | Research Projects:
Contributions: Developed an Accurate and Reliable System Power and Thermal Models for Single Core and Multicore Architectures Using a Novel, Fast, Light Weight and Accurate System Level Energy Estimation Method, Conducted a Comparative Study of Various Energy Efficient Task Scheduling Methods Developed an Efficient and Fast Synthetic Simulation Platform using MATLAB, C++, Perl Developed a Practical Simulation Platform Combining, Architecture Level Simulators, SimpleScalar and HotSpot, to Test Different Scheduling Techniques with Industry Standard Benchmarks
Contributions: Incorporating Critical Leakage-Temperature Dependency into System Models Developed an Effective Scheduling Scheme “M-Oscillations” to Minimize the Peak Temperature of the Processors. Proposed Several Fundamental Principles to Minimize the Peak Temperature on Single Core Processors Addressed Issues Related to Performance Optimization under Maximum Temperature Constraints Closely Studied the Neighboring Effects on the Thermal Dynamics of a Core on Multicore Processors Developed Task Feasibility Analysis Methods on Multicore Processors Developed Simulation Platform using C++, MATLAB, Perl, HotSpot and SimpleScalar to Validate the Accuracy and Effectiveness of Proposed Algorithms and Theorems
|
|||||||||
Internship Experience | Validation Intern (Micro-Electronics Group), SUN Microsystems, Burlington, MA, USA, Summer-2007
Responsibilities and Contributions: Performed Post-Silicon Validation on the IO Subsystem to Verify Protocols Error Injection and Detection on Service Links Bug Reporting and Result Documentations Coding in C++, TCL on UNIX Platform Developed Testing Codes for Validation |
|||||||||
Publications: | JOURNALS: J1) V. Chaturvedi, H. Huang, S. Ren, G. Quan, “On the Fundamentals of Leakage Aware Real-Time DVS Scheduling for Peak Temperature Minimization”, Journal of Systems Architecture (JSA), Vol. 58, No. 10, 387-397, 2012J2) H. Huang, V. Chaturvedi, G. Quan, “Leakage Aware Scheduling On Maximum Temperature Minimization For Periodic Hard Real-Time Systems”, Journal of Low Power Electronics (JOLPE), Vol. 8, No. 4, 378-393, 2012 J3) G. Quan, V. Chaturvedi, “Feasibility Analysis for Temperature-Constraint Hard Real-time Periodic Tasks”, IEEE Transactions on Industrial Informatics (TII), Vol. 6, No. 3, 329-339, 2010 J4) H. Huang, V. Chaturvedi, G. Quan, “Throughput Maximization for Periodic Real-Time Systems under the Maximal Temperature Constraint”, IEEE Transactions on VLSI. (under review) CONFERENCES:C1) V. Chaturvedi, G. Quan, “Leakage Conscious DVS Scheduling for Peak Temperature Minimization”, IEEE/ACM Asia and South Pacific Design Automation Conference (ASP-DAC), Yokohama, Japan, 2011 pg. 135-140 (Acceptance ratio: 30.7%)C2) V. Chaturvedi, H. Huang, G. Quan, “Leakage Aware Scheduling On Maximal Temperature Minimization For Periodic Hard Real-Time Systems”, The 7th IEEE International Conference on Embedded Software and Systems (ICESS), Bradford, UK, June 29-July 01, 2010, pg. 1802-1809 (Acceptance ratio 28%)C3) V. Chaturvedi, P. Thanarungroj, C. Liu, G. Quan, “Validation of Scheduling Techniques to Reduce Peak Temperature on an Architectural Level Platform Set-up”, IEEE SoutheastCon, 2011, Nashville, TN, 111-116
C4) M. Fan, V. Chaturvedi, S. Sha, G. Quan, “Thermal-Aware Energy Minimization for Real-Time Scheduling on Multi-core Systems”, IEEE Real-Time Systems Symposium (WiP-RTSS), 2012, San Juan, PR, USA C5) M. Fan, V. Chaturvedi, S. Sha, G. Quan, “Feasibility Analysis for Temperature Constrained Real-Time Scheduling on Multi-Core Platforms”, IEEE/ACM Design Automation Conference (wip-DAC), 2013 C6) M. Fan, V. Chaturvedi, S. Sha, G. Quan, “Energy Calculation for Multi-core Systems with Leakage and Temperature Consideration”, IEEE/ACM International Symposium on Low Power Electronics and Design (ISLPED), 2013, (submitted) |